AP1184K5-15L-13 datasheet by Diodes Incorporated

AP1184K5-15L-13 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, using a minimum of 2oz copper thickness, and ensuring good thermal conduction to the surrounding copper area. A thermal via array can also be used to improve heat dissipation.
• How do I ensure the device is stable and does not oscillate?
  To ensure stability, it's essential to follow the recommended output capacitor selection and layout guidelines. Additionally, the input capacitor should be placed close to the device, and the input voltage should be well-regulated. A minimum of 1uF output capacitance is recommended, and the ESR should be less than 1 ohm.
• What is the maximum junction temperature that the device can withstand?
  The maximum junction temperature that the AP1184K5-15L-13 can withstand is 150°C. However, it's recommended to operate the device at a junction temperature below 125°C to ensure reliable operation and long-term reliability.
• Can I use this device in a high-reliability or automotive application?
  The AP1184K5-15L-13 is an industrial-grade device, but it's not specifically designed for high-reliability or automotive applications. For such applications, it's recommended to use devices that meet the relevant standards, such as AEC-Q100 or MIL-STD-883.
• How do I calculate the power dissipation of the device?
  The power dissipation of the AP1184K5-15L-13 can be calculated using the formula: Pd = (Vin - Vout) x Iout + (Vin x Iq), where Vin is the input voltage, Vout is the output voltage, Iout is the output current, and Iq is the quiescent current.