The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using multiple vias to dissipate heat to the other layers. A minimum of 2oz copper thickness is recommended.
To ensure stable output voltage regulation, it is recommended to use a minimum output capacitance of 10uF, with an ESR of less than 1 ohm. Additionally, the input capacitor should be placed as close to the VIN pin as possible, and the output capacitor should be placed as close to the VOUT pin as possible.
The maximum input voltage that can be applied to the AP1701FWL-7 is 18V, although the recommended maximum input voltage is 15V for optimal reliability and performance.
The power dissipation of the AP1701FWL-7 can be calculated using the formula: Pd = (VIN - VOUT) x IOUT + VIN x IQ, where IQ is the quiescent current. The junction temperature should be kept below 125°C to ensure reliable operation.
Yes, the AP1701FWL-7 is compatible with lead-free soldering processes, with a peak reflow temperature of 260°C.
AP1701FWL-7 datasheet
by Diodes Incorporated
