AR1820HSSC12SHEA0-DR datasheet by onsemi

AR1820HSSC12SHEA0-DR Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
• How do I ensure reliable operation in high-temperature environments?
  Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power consumption at high temperatures.
• What is the recommended input capacitor value and type for this device?
  A 10uF to 22uF X7R or X5R ceramic capacitor is recommended, placed as close to the device as possible. The capacitor should be rated for the input voltage and have a low ESR.
• How do I minimize electromagnetic interference (EMI) in my design?
  Use a shielded enclosure, keep the device and its components away from the PCB edge, and use a common-mode choke or ferrite bead on the input lines. Also, ensure good PCB layout practices, such as separating analog and digital grounds.
• What is the recommended output capacitor value and type for this device?
  A 10uF to 22uF X7R or X5R ceramic capacitor is recommended, placed as close to the device as possible. The capacitor should be rated for the output voltage and have a low ESR.