The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with a minimum size of 20mm x 20mm, and ensuring that the thermal pad is connected to a solid ground plane. Additionally, it is recommended to use a minimum of 2oz copper thickness and to avoid placing any vias or thermal reliefs under the device.
To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power dissipation according to the temperature derating curve provided in the datasheet. Additionally, it is recommended to use a heat sink with a thermal resistance of less than 10°C/W and to ensure good airflow around the device.
The recommended soldering conditions for the AUIPS1051LTR are a peak temperature of 260°C, a dwell time of 10-30 seconds, and a soldering iron temperature of 350°C. It is also recommended to use a solder with a melting point of 217°C or higher.
To protect the device from EOS and ESD, it is recommended to use a TVS (transient voltage suppressor) diode or a zener diode on the input pins, and to follow proper handling and storage procedures to prevent ESD damage.
The recommended input capacitor value and type for the AUIPS1051LTR are a ceramic capacitor with a value of 10uF to 22uF and a voltage rating of 50V or higher. The capacitor should be placed as close as possible to the device's input pins.
AUIPS1051LTR datasheet
by International Rectifier
