The recommended PCB footprint for the B3100-13-F is a standard SOT23 package with a 1.3mm x 1.3mm body size. A minimum pad size of 0.8mm x 0.8mm is recommended for reliable soldering.
To ensure proper biasing, connect the input pin (VIN) to a stable voltage source, and the enable pin (EN) to a logic-level signal. The output pin (VOUT) should be decoupled with a 1uF ceramic capacitor to minimize noise and ripple.
The B3100-13-F is rated for operation in ambient temperatures ranging from -40°C to 85°C. However, the device's performance and reliability may degrade if operated outside this range for extended periods.
While the B3100-13-F is a high-quality device, it is not specifically designed for high-reliability or automotive applications. For such applications, consider using devices with specific automotive or high-reliability certifications, such as AEC-Q100 or MIL-STD-883.
To troubleshoot issues with the B3100-13-F, first verify the input voltage and enable pin signals. Check for proper PCB layout, decoupling, and thermal management. If issues persist, consult the datasheet and application notes or contact Diodes Incorporated's technical support for further assistance.
B3100-13-F datasheet
by Diodes Incorporated
