BD9B305QUZ-E2 datasheet by ROHM Semiconductor

BD9B305QUZ-E2 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  A recommended PCB layout for optimal thermal performance would be to have a large copper area on the bottom layer connected to the thermal pad, and to use thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
• How do I ensure the stability of the output voltage?
  To ensure the stability of the output voltage, it is recommended to use a minimum output capacitance of 10uF, and to place the output capacitor close to the output pin. Additionally, a 1uF ceramic capacitor can be added in parallel to improve high-frequency stability.
• What is the maximum input voltage that can be applied to the device?
  The maximum input voltage that can be applied to the device is 18V. Exceeding this voltage may cause damage to the device.
• How do I protect the device from overcurrent?
  To protect the device from overcurrent, a current limiting resistor can be added in series with the input voltage. Additionally, a fuse or a PTC thermistor can be used to limit the current in case of a fault condition.
• What is the recommended input capacitor value and type?
  The recommended input capacitor value is 1uF to 10uF, and the recommended type is a ceramic capacitor with an X7R or X5R dielectric. This helps to filter out high-frequency noise and improve the stability of the output voltage.