The maximum operating frequency of the BLF244,112 is 1400 MHz.
The typical output power of the BLF244,112 is 112 W at 915 MHz and 140 W at 2450 MHz.
The thermal resistance of the BLF244,112 is 0.5°C/W (junction-to-case) and 10°C/W (junction-to-ambient).
The recommended PCB layout for the BLF244,112 involves using a 4-layer PCB with a solid ground plane, and placing the device near the edge of the board to minimize thermal resistance.
To optimize the performance of the BLF244,112, ensure proper thermal management, use a low-loss PCB material, and optimize the input and output matching networks for maximum power transfer.
BLF244,112 datasheet
by NXP Semiconductors
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