BLF881,112 datasheet by NXP Semiconductors

BLF881,112 Frequently Asked Questions (FAQs)

• What is the maximum power dissipation of the BLF881,112?
  The maximum power dissipation of the BLF881,112 is 125 W, but it can be increased to 250 W with proper heat sinking.
• How do I optimize the performance of the BLF881,112 in a high-frequency application?
  To optimize the performance of the BLF881,112 in a high-frequency application, use a low-loss PCB material, minimize lead lengths, and use a suitable heat sink to reduce thermal resistance.
• What is the recommended operating voltage range for the BLF881,112?
  The recommended operating voltage range for the BLF881,112 is 28 V to 50 V, but it can operate up to 60 V with reduced performance.
• How do I protect the BLF881,112 from electrostatic discharge (ESD)?
  To protect the BLF881,112 from ESD, use an ESD wrist strap or mat, handle the device by the body, and avoid touching the pins or leads.
• What is the maximum junction temperature of the BLF881,112?
  The maximum junction temperature of the BLF881,112 is 175°C, but it's recommended to keep it below 150°C for optimal performance and reliability.