A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the layout symmetrical, and use a star-configuration for the power supply connections to minimize noise and EMI.
Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow, and consider using a thermal pad or thermal tape to improve heat dissipation.
Monitor the input voltage, output voltage, output current, and temperature. Also, keep an eye on the device's power dissipation, especially during high-load or high-temperature conditions.
Use a voltage regulator or a voltage supervisor to ensure the input voltage remains within the recommended range. Add overvoltage protection (OVP) and undervoltage protection (UVP) circuits to prevent damage from voltage transients or faults.
Use a low-ESR ceramic capacitor with a value between 10uF to 22uF, depending on the specific application and operating frequency. Ensure the capacitor is rated for the maximum input voltage and operating temperature.