NXP provides a recommended PCB layout in the application note AN11529, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
To minimize power consumption, configure the device to use the lowest possible voltage supply (VDD) and adjust the clock frequency (CLK) according to your application's requirements. Additionally, use the power-down mode (PDN) and disable unnecessary peripherals when not in use.
The BT131-800D,412 is rated for operation between -40°C and 105°C (ambient temperature). However, it's essential to consider the thermal management of your design, as high temperatures can affect the device's performance and reliability.
To ensure EMC, follow the guidelines in the NXP application note AN11529, which provides recommendations for PCB layout, component selection, and shielding. Additionally, consider using a metal shield or a Faraday cage to minimize electromagnetic radiation.
The recommended crystal oscillator frequency for the BT131-800D,412 is 32.768 kHz. This frequency is used as the clock source for the device's internal oscillator and ensures accurate timing and synchronization.
BT131-800D,412 datasheet
by NXP Semiconductors
