A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the layout symmetrical, and use a star topology for the power supply. Minimize the distance between the IC and the antenna, and use a 50-ohm transmission line to connect the IC to the antenna.
Use a 50-ohm antenna with a quarter-wavelength monopole or dipole design. The antenna should be placed at least 10 mm away from the PCB edge and 5 mm away from any metal components. Optimize the antenna design using simulation tools like CST Studio Suite or ANSYS HFSS.
The maximum operating temperature range for the BT131-800E,412 is -40°C to +85°C. However, the device can be operated up to +105°C for short periods (less than 10 minutes) during manufacturing or testing.
Use a metal shield around the module, and ensure the PCB layout is designed to minimize radiation. Use a common-mode choke or ferrite bead to filter the power supply lines. Follow the guidelines in the NXP application note AN11529 for EMC compliance.
Use a 10 uF ceramic capacitor and a 100 nF ceramic capacitor in parallel, placed as close as possible to the power pins of the module. Add a 10 ohm resistor in series with the power supply line to reduce noise and ringing.
BT131-800E,412 datasheet
by NXP Semiconductors
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