STMicroelectronics recommends a PCB layout with a large copper area connected to the tab of the device to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate to further improve thermal dissipation.
To protect the BTA25-400B from overvoltage and overcurrent conditions, it is recommended to use a varistor or a transient voltage suppressor (TVS) in parallel with the device. Additionally, a fuse or a current limiter can be used in series with the device to prevent overcurrent conditions.
The maximum allowed case temperature for the BTA25-400B is 150°C. However, it is recommended to keep the case temperature below 120°C to ensure reliable operation and to prevent thermal runaway.
The BTA25-400B is not recommended for high-frequency switching applications above 100 kHz. The device is designed for low-frequency switching applications, and high-frequency operation may lead to increased losses and reduced reliability.
To ensure proper soldering of the BTA25-400B to the PCB, it is recommended to use a soldering iron with a temperature of 250°C to 270°C, and to apply a small amount of solder paste to the pads. The device should be soldered within 10 seconds to prevent thermal damage.
BTA25-400B datasheet
by STMicroelectronics
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