STMicroelectronics recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently.
To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, use a suitable heat sink, and consider derating the device's power dissipation according to the temperature range.
Although the datasheet doesn't specify a maximum allowed voltage, it's recommended to limit the input voltage to 5.5V to prevent damage to the internal ESD protection diodes.
Yes, the BU922T is suitable for high-frequency switching applications up to 100 kHz. However, it's essential to consider the device's switching characteristics, such as rise and fall times, and ensure proper PCB layout and decoupling to minimize electromagnetic interference (EMI).
To prevent damage or unexpected behavior, it's recommended to follow a controlled power-up and power-down sequence, ensuring that the input voltage is stable and within the recommended range before applying the enable signal.
BU922T datasheet
by STMicroelectronics
