Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    Part Img BUZ90 datasheet by Siemens

    • SIPMOS Power Transistor (N channel Enhancement mode Avalanche-rated)
    • Original
    • No
    • Transferred
    • EAR99
    • 8541.29.00.95
    • 8541.29.00.80
    • Find it at Findchips.com

    BUZ90 datasheet preview

    BUZ90 Frequently Asked Questions (FAQs)

    • The maximum safe operating area (SOA) for the BUZ90 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance and maximum junction temperature. As a general guideline, the SOA is typically limited by the device's thermal capabilities, and it's recommended to keep the device within the specified thermal boundaries to ensure reliable operation.
    • To ensure the BUZ90 is properly biased, it's essential to follow the recommended biasing scheme outlined in the datasheet. This typically involves setting the base-emitter voltage (VBE) and collector-emitter voltage (VCE) within the specified ranges. Additionally, it's crucial to ensure the device is operated within its recommended operating conditions, including temperature, current, and voltage.
    • Operating the BUZ90 at high temperatures can lead to reduced performance, decreased reliability, and potentially even device failure. High temperatures can cause the device's thermal resistance to increase, leading to reduced current handling capabilities and increased power dissipation. It's essential to ensure the device is operated within its recommended temperature range to maintain optimal performance and reliability.
    • To ensure ESD protection when working with the BUZ90, it's essential to follow proper handling and storage procedures. This includes using anti-static wrist straps, mats, and packaging materials, as well as grounding all equipment and tools. Additionally, it's recommended to use ESD-protected workstations and to handle the devices by the body, rather than the leads, to minimize the risk of ESD damage.
    • When designing a PCB layout for the BUZ90, it's essential to consider thermal management and heat dissipation. This includes using thermal vias, heat sinks, and thermal interfaces to ensure efficient heat transfer. Additionally, it's recommended to follow good PCB design practices, such as minimizing trace lengths, using wide traces for power lines, and avoiding sharp corners and acute angles.
    Price & Stock Powered by Findchips Logo
    Supplyframe Tracking Pixel