The SOA for the BUZ90A is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance and maximum junction temperature. As a general rule, it's recommended to keep the device within the SOA to prevent thermal runaway and ensure reliable operation.
To ensure proper biasing, follow the recommended biasing scheme outlined in the datasheet. This typically involves setting the base-emitter voltage (VBE) to around 0.7V and the collector-emitter voltage (VCE) to the desired level. Additionally, ensure the base current is sufficient to maintain the desired collector current.
For optimal thermal performance, it's recommended to use a PCB layout that allows for good heat dissipation. This can be achieved by using a thermal pad or heat sink, and ensuring good airflow around the device. Additionally, follow standard PCB design practices to minimize thermal resistance and ensure reliable operation.
To protect the BUZ90A from ESD, follow standard ESD protection practices, such as using ESD-safe handling and storage procedures, and incorporating ESD protection devices (e.g., TVS diodes) into the circuit design.
The BUZ90A is a high-reliability device with a typical lifespan of 10-20 years or more, depending on operating conditions and environmental factors. However, it's essential to follow proper design, manufacturing, and testing procedures to ensure the device meets its expected lifespan.
BUZ90A datasheet
by Siemens
