The recommended land pattern for BZX284-C11,115 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask clearance of 0.1 mm. The pad should be centered on the component and have a thermal relief connection to the ground plane.
To handle the ESD sensitivity of BZX284-C11,115, it is recommended to use ESD-safe handling and assembly procedures, such as using anti-static wrist straps, mats, and packaging materials. Additionally, the component should be stored in a dry, ESD-safe environment, and assembly should be done in a controlled, ESD-safe area.
The maximum allowable voltage derating for BZX284-C11,115 is 10% of the nominal working voltage. This means that if the nominal working voltage is 11V, the maximum allowable voltage derating would be 1.1V.
While BZX284-C11,115 is rated for operation up to 150°C, it is not recommended to use it in high-temperature environments above 125°C for extended periods of time. Prolonged exposure to high temperatures can affect the component's reliability and lifespan.
The correct polarity of BZX284-C11,115 can be determined by looking at the marking on the component. The cathode (negative leg) is marked with a band, while the anode (positive leg) is not marked.
BZX284-C11,115 datasheet
by NXP Semiconductors
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