BZX84-B6V2 datasheet by NXP Semiconductors

BZX84-B6V2 Frequently Asked Questions (FAQs)

• What is the recommended footprint for the BZX84-B6V2?
  The recommended footprint for the BZX84-B6V2 is a standard SOD323 package with a pad size of 0.8mm x 0.8mm and a pitch of 0.5mm.
• Can I use the BZX84-B6V2 in a high-temperature environment?
  The BZX84-B6V2 is rated for operation up to 150°C, but it's recommended to derate the voltage and current ratings above 125°C. Consult the datasheet for specific derating curves.
• How do I ensure the BZX84-B6V2 is properly soldered?
  Use a soldering iron with a temperature of 260°C to 280°C, and apply a soldering time of 2-3 seconds. Ensure the solder fillet is smooth and shiny, and avoid applying excessive force or vibration during soldering.
• Is the BZX84-B6V2 suitable for high-frequency applications?
  The BZX84-B6V2 is a general-purpose diode, not optimized for high-frequency applications. For high-frequency applications, consider using a diode with a lower capacitance and inductance, such as the BAV199 or BAS70 series.
• Can I use the BZX84-B6V2 in a switching power supply?
  The BZX84-B6V2 is not recommended for switching power supplies due to its relatively high reverse recovery time (trr) of 50ns. Consider using a diode with a faster trr, such as the 1N4148 or 1N4937, for switching power supply applications.