BZX84C33-7-F datasheet by Diodes Incorporated

BZX84C33-7-F Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the BZX84C33-7-F?
  The recommended land pattern for the BZX84C33-7-F is a rectangular pad with a size of 0.8mm x 1.6mm, with a solder mask clearance of 0.1mm.
• Can I use the BZX84C33-7-F in a high-temperature environment?
  The BZX84C33-7-F is rated for operation up to 150°C, but it's recommended to derate the voltage and current ratings at higher temperatures. Consult the datasheet for specific derating curves.
• How do I handle the BZX84C33-7-F during assembly to prevent damage?
  Handle the BZX84C33-7-F by the body, not the leads, to prevent damage. Avoid bending or flexing the leads, and use a pick-and-place machine or a vacuum pickup tool to handle the device.
• What is the recommended soldering profile for the BZX84C33-7-F?
  The recommended soldering profile for the BZX84C33-7-F is a peak temperature of 260°C, with a dwell time of 10-30 seconds. Consult the datasheet for a detailed soldering profile.
• Can I use the BZX84C33-7-F in a high-humidity environment?
  The BZX84C33-7-F is not hermetically sealed, so it's not recommended for use in high-humidity environments. If you must use it in a humid environment, ensure proper conformal coating and sealing to prevent moisture ingress.