BZX84C3V6 datasheet by Diodes Incorporated

BZX84C3V6 Frequently Asked Questions (FAQs)

• What is the recommended footprint for the BZX84C3V6?
  The recommended footprint for the BZX84C3V6 is a standard SOD123 package with a pad size of 0.8mm x 0.8mm and a spacing of 0.5mm between pads.
• Can I use the BZX84C3V6 in a high-temperature environment?
  The BZX84C3V6 is rated for operation up to 150°C, but it's recommended to derate the voltage and current ratings at higher temperatures. Consult the datasheet for specific derating guidelines.
• How do I ensure the BZX84C3V6 is properly soldered?
  To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Avoid applying excessive heat or pressure, which can damage the device.
• Can I use the BZX84C3V6 in a high-frequency application?
  The BZX84C3V6 is a general-purpose Zener diode and is not optimized for high-frequency applications. For high-frequency applications, consider using a Zener diode specifically designed for high-frequency use, such as the BZX84C3V6HF.
• What is the typical leakage current of the BZX84C3V6?
  The typical leakage current of the BZX84C3V6 is less than 1μA at 25°C, but this can vary depending on the specific device and operating conditions. Consult the datasheet for specific leakage current ratings.