A 4-layer PCB with a solid ground plane and a separate layer for the RF signal is recommended. The RF signal should be routed on the top layer, and the ground plane should be on the bottom layer. Decoupling capacitors should be placed close to the device.
The antenna design should be optimized for the specific frequency band of operation. A quarter-wavelength monopole antenna or a dipole antenna is recommended. The antenna should be matched to the device's output impedance (typically 50 ohms) using a pi-network or a balun.
A 10uF ceramic capacitor and a 100nF ceramic capacitor in parallel, placed close to the device's power pins, are recommended for decoupling. Additional decoupling capacitors may be required depending on the specific application and PCB layout.
The device should be configured using the SmartRF Studio software provided by Texas Instruments. The software allows for configuration of the device's registers, frequency, modulation, and other parameters. The optimal configuration will depend on the specific application and requirements.
The device has a maximum junction temperature of 150°C. Thermal vias should be used to dissipate heat from the device to the PCB. A thermal pad on the bottom of the device should be connected to a solid ground plane or a thermal ground plane.
CC113LRGPR datasheet
by Texas Instruments
