The recommended land pattern for CIG10F1R0MNC is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This ensures reliable soldering and minimizes the risk of solder bridging.
CIG10F1R0MNC is a moisture-sensitive device (MSD). To prevent damage, it's essential to store the components in a dry environment (less than 20% RH) and follow the recommended baking procedure before reflow soldering. Refer to the Samsung Electro-Mechanics' guidelines for MSD handling.
The maximum reflow temperature for CIG10F1R0MNC is 260°C, with a peak temperature not exceeding 240°C for more than 20 seconds. Exceeding this temperature may cause damage to the component.
While CIG10F1R0MNC is designed to be robust, it's essential to evaluate the component's performance in high-vibration environments. Samsung Electro-Mechanics recommends performing vibration testing according to IEC 60068-2-6 to ensure the component's reliability in such applications.
To ensure EMC, follow proper PCB design guidelines, such as keeping the component away from high-frequency signal lines, using proper grounding, and implementing adequate shielding. Additionally, consider performing EMC testing according to relevant standards (e.g., IEC 61000-4-2) to validate the design.
