The recommended soldering temperature profile for the CL31B226MPHNNNE capacitor is a peak temperature of 260°C for 10-30 seconds, with a ramp-up rate of 3°C/s and a ramp-down rate of 6°C/s.
The ESR of the CL31B226MPHNNNE capacitor is 0.015 ohms, which is relatively low. This means that the capacitor has low internal resistance, resulting in less energy loss and heat generation, making it suitable for high-frequency applications.
The maximum operating voltage derating for the CL31B226MPHNNNE capacitor is 80% of the rated voltage, which is 16V for this specific part. This means that the capacitor should not be operated above 12.8V to ensure reliable performance and prevent premature failure.
The capacitance of the CL31B226MPHNNNE capacitor decreases with increasing temperature. The temperature coefficient of capacitance is -55 ppm/°C, which means that the capacitance decreases by 0.055% for every 1°C increase in temperature.
The recommended land pattern and pad layout for the CL31B226MPHNNNE capacitor can be found in the Samsung Electro-Mechanics application note or in the IPC-7351 standard. The land pattern should be designed to minimize thermal stress and ensure reliable solder joints.