API Delevan recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat. A minimum of 2 oz copper thickness is recommended for the top and bottom layers. Additionally, a thermal pad on the bottom of the device should be connected to a heat sink or a thermal management system.
The CM6460-335 requires a specific biasing scheme to operate within its optimal performance range. API Delevan recommends using a voltage regulator to maintain a stable voltage supply, and ensuring that the input and output pins are properly terminated to prevent oscillations and reflections.
While the datasheet specifies an operating temperature range of -40°C to +85°C, API Delevan recommends derating the device's power handling capabilities above +70°C to ensure reliable operation and prevent thermal runaway.
API Delevan recommends using a combination of simulation tools and measurement techniques such as spectrum analysis and time-domain reflectometry to identify and troubleshoot issues. Additionally, ensuring proper PCB layout, component selection, and biasing can help prevent common issues.
Yes, the CM6460-335 is a high-frequency device and requires careful attention to EMI/EMC considerations. API Delevan recommends using shielding, filtering, and proper grounding techniques to minimize electromagnetic interference and ensure compliance with relevant regulatory standards.
