API Delevan recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A minimum of 2 oz copper thickness is recommended for the top layer. Additionally, a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K is suggested between the device and the heat sink.
The CM6560R-504 requires a bias voltage of 15V ± 10% and a bias current of 100 mA ± 10%. Ensure the bias circuitry is designed to provide a stable voltage and current, and that the device is properly terminated to prevent oscillations.
The CM6560R-504 is designed to handle a maximum power of 50 W. Exceeding this power rating may result in reduced performance, reliability issues, or even device failure.
Common issues can be troubleshooted by checking the PCB layout for proper grounding and decoupling, ensuring the bias circuitry is stable and within specifications, and verifying that the device is properly terminated. API Delevan also recommends using a spectrum analyzer to identify any unwanted frequency components.
Yes, the CM6560R-504 is sensitive to electrostatic discharge (ESD). Handle the device with ESD-safe materials, and store it in a protective package or anti-static bag. API Delevan recommends following the ESD handling and storage guidelines outlined in the JEDEC standard JESD625-A.
