Wolfspeed recommends a PCB layout with a solid ground plane, minimal thermal resistance, and a heat sink attached to the device. A thermal management strategy should include a heat sink with a thermal interface material, and a thermal resistance of less than 1°C/W.
To ensure reliable operation, operate the device within the recommended temperature range (TJ ≤ 150°C), and ensure proper cooling. Monitor the device's temperature using the built-in temperature sensor, and implement thermal shutdown or current limiting to prevent overheating.
Wolfspeed recommends using a conjugate match at the input and output ports to achieve optimal performance. The recommended matching network can be found in the application note or by consulting with Wolfspeed's technical support team.
Handle the device with ESD-protective equipment and follow proper ESD handling procedures. The device has built-in ESD protection, but it is not foolproof. Take precautions to prevent ESD events, and consider adding external ESD protection devices if necessary.
Follow Wolfspeed's recommended soldering and assembly procedures, which include using a soldering iron with a temperature of 250°C or less, and a soldering time of 3 seconds or less. Use a solder with a melting point above 217°C, and ensure the device is properly cleaned and dried before assembly.
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