DAN202FMFHT106 datasheet by ROHM Semiconductor

DAN202FMFHT106 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  ROHM recommends a thermal pad size of at least 2.5mm x 2.5mm, with multiple vias to the ground plane to ensure efficient heat dissipation. A thermal resistance of 10°C/W or less is recommended.
• How do I ensure the device operates within the safe operating area (SOA)?
  To ensure SOA, monitor the device's voltage, current, and temperature. ROHM provides a SOA graph in the datasheet, which can be used to determine the safe operating region. Additionally, consider using overcurrent protection and thermal monitoring circuits.
• What is the recommended storage condition for the DAN202FMFHT106?
  ROHM recommends storing the device in a dry, cool place, away from direct sunlight and moisture. The storage temperature should be between -40°C and 125°C, and the humidity should be below 60%.
• Can I use the DAN202FMFHT106 in a high-reliability application?
  Yes, the DAN202FMFHT106 is suitable for high-reliability applications. ROHM has qualified the device according to the AEC-Q101 standard, which ensures its suitability for automotive and other high-reliability applications.
• How do I handle the device's ESD sensitivity?
  ROHM recommends handling the device with ESD-protective equipment and following proper ESD handling procedures. The device has a human body model (HBM) ESD rating of 2kV and a machine model (MM) ESD rating of 200V.