Diodes Incorporated recommends a PCB layout with a large copper area connected to the thermal pad (exposed pad) on the bottom of the package to dissipate heat efficiently. A minimum of 1 oz copper thickness is recommended, and the copper area should be connected to a solid ground plane to reduce thermal resistance.
To ensure proper biasing, the device requires a stable input voltage (VCC) and a bias resistor (RBIAS) connected between the input pin and the output pin. The recommended RBIAS value is typically between 1 kΩ to 10 kΩ, depending on the specific application requirements.
The DDA114EH-7 is rated for operation from -40°C to +125°C, making it suitable for a wide range of industrial and automotive applications.
To prevent ESD damage, it is recommended to handle the device with an anti-static wrist strap or mat, and to use ESD-protected packaging and storage materials. Additionally, the device should be assembled into the PCB using an ESD-protected workstation and tools.
Diodes Incorporated recommends a soldering profile with a peak temperature of 260°C (500°F) for a maximum of 10 seconds, using a solder with a melting point of 220°C (428°F) or higher.
