The recommended PCB footprint for the DG2730DN-T1-GE4 is a 4-pad QFN package with a 2x2 mm body size and 0.5 mm pitch. A recommended land pattern is available in the Vishay Intertechnologies application note AN81142.
To ensure reliable operation in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking and airflow. The device is rated for operation up to 125°C, but derating may be necessary for extended reliability.
The recommended drive strength for the DG2730DN-T1-GE4 is a 10-20 mA output current, depending on the specific application requirements. It is essential to ensure that the drive strength is sufficient to maintain signal integrity and prevent signal degradation.
The DG2730DN-T1-GE4 has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. This includes using ESD-safe materials, grounding straps, and wrist straps to prevent damage to the device.
The recommended power sequencing for the DG2730DN-T1-GE4 is to power up the VCC supply before the VEE supply. This ensures proper device operation and prevents potential latch-up or damage to the device.
DG2730DN-T1-GE4 datasheet
by Vishay Siliconix
