A 4-layer PCB with a solid ground plane and a separate analog and digital power plane is recommended. Keep the analog and digital sections separate, and use a ferrite bead or inductor to isolate the analog power supply.
Use a metal shield around the DG300AAK/883B, and ensure the PCB layout is designed to minimize radiation. Use a common-mode choke or ferrite bead on the input power lines to reduce electromagnetic interference (EMI).
A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for the input capacitor. The capacitor should be placed as close as possible to the VIN pin.
Use a thermal pad or thermal interface material (TIM) to improve heat transfer between the device and the PCB. Ensure good airflow around the device, and consider using a heat sink if the device is expected to operate at high temperatures.
A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for the output capacitor. The capacitor should be placed as close as possible to the VOUT pin.
DG300AAK/883B datasheet
by Maxim Integrated Products
