The recommended PCB footprint for the DG303BDY-T1 is a rectangular pad with a size of 1.6 mm x 0.8 mm, with a 0.3 mm radius corner and a 0.2 mm spacing between pads.
To handle the DG303BDY-T1's ESD sensitivity, follow standard ESD precautions such as using an ESD wrist strap, ESD mat, and ESD-safe packaging. Ensure that all equipment and tools are properly grounded, and avoid touching the device's pins or body.
The maximum allowable voltage for the DG303BDY-T1's control pins is 5.5 V, which is the maximum rating for the device's logic inputs. Exceeding this voltage may cause damage to the device.
The DG303BDY-T1 is rated for operation up to 125°C. However, it's essential to consider the device's power dissipation and thermal management when operating in high-temperature environments. Ensure that the device is properly heat-sinked and that the maximum junction temperature (Tj) is not exceeded.
To ensure the DG303BDY-T1's analog switches are properly turned on and off, apply a valid logic signal to the control pins (IN1 and IN2) and ensure that the voltage supply (VCC) is within the recommended operating range. Avoid applying invalid or floating logic signals, as this may cause unintended switch behavior.
DG303BDY-T1 datasheet
by Vishay Siliconix
