The recommended PCB footprint for the DG444BDN-T1-E4 is a standard SOIC-8 package with a minimum pad size of 1.5mm x 1.5mm and a maximum pad size of 2.5mm x 2.5mm, with a 0.5mm spacing between pads.
To ensure reliable operation of the DG444BDN-T1-E4 in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device.
The maximum allowable power dissipation for the DG444BDN-T1-E4 is 1.4W, and it is recommended to derate the power dissipation by 2.5mW/°C above 25°C to ensure reliable operation.
Yes, the DG444BDN-T1-E4 can be used in high-frequency applications up to 100MHz, but it is recommended to follow proper PCB layout and design practices to minimize parasitic inductance and capacitance.
Yes, the DG444BDN-T1-E4 is compatible with lead-free soldering processes, and it is recommended to follow the manufacturer's recommended soldering profile to ensure reliable assembly.
DG444BDN-T1-E4 datasheet
by Vishay Siliconix
