A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
Use a heat sink or thermal pad, ensure good airflow, and consider derating the device's power consumption at high temperatures. Also, ensure the device is soldered correctly to prevent thermal resistance.
The maximum allowed voltage on the input pins is 5.5V, exceeding this may cause damage to the device. Use voltage limiting resistors or clamping diodes to prevent overvoltage.
Check the input voltage, output load, and PCB layout. Ensure the device is properly soldered and the output capacitor is of sufficient value. Use an oscilloscope to measure the output voltage and check for oscillations or noise.
Yes, but ensure the devices are properly synchronized and the output capacitors are of sufficient value to prevent oscillations. Also, consider the increased power consumption and thermal requirements.