Diodes Incorporated recommends a PCB layout with a solid ground plane and a thermal relief pattern to ensure good thermal conductivity. A minimum of 2oz copper thickness is recommended for optimal thermal performance.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including derating the power dissipation according to the temperature derating curve. Additionally, ensure good thermal management, such as using a heat sink or thermal interface material, and avoid exceeding the maximum junction temperature (Tj) of 150°C.
Diodes Incorporated recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a ramp-up rate of 3°C/s. It's essential to follow the recommended soldering profile to prevent damage to the device.
The DRDPB26W-7 is not hermetically sealed, so it's not recommended for use in high-humidity environments. If you need to operate the device in a humid environment, consider using a conformal coating or potting the device to protect it from moisture.
Diodes Incorporated recommends storing the DRDPB26W-7 in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -40°C to 100°C, and the recommended storage humidity is 60% RH or less.
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