The recommended power-up sequence is to apply VCC first, followed by VEE. This ensures that the internal bias circuitry is properly initialized.
Ensure that the device is properly heat-sinked and that the ambient temperature is within the specified range of -40°C to +85°C. Also, avoid overheating the device during soldering or rework.
The DS1669-100+ can drive up to 100pF of capacitive load. Exceeding this limit may affect the device's stability and performance.
Yes, the DS1669-100+ can be used in switching power supply applications. However, ensure that the device is properly bypassed and decoupled to minimize noise and ripple.
Check the PCB layout for proper grounding and decoupling. Ensure that the input and output capacitors are properly selected and placed. Also, verify that the device is operated within its specified voltage and current ranges.