Maxim Integrated provides a layout and routing guide in their application note AN1441, which recommends a 4-layer PCB with a solid ground plane, and careful routing of the clock and data lines to minimize noise and crosstalk.
The thermal shutdown feature is intended to protect the device from overheating. When the device exceeds the thermal shutdown threshold, it will shut down until the temperature drops below the thermal shutdown hysteresis. To handle this, ensure proper thermal design and heat sinking, and consider implementing a thermal monitoring and shutdown circuit in your system.
The recommended power-up sequence is to apply VCC first, followed by VDD, and then the clock signal. This ensures that the internal voltage regulators are properly initialized and the device is configured correctly.
Start by verifying the power supply and clock signal integrity, then check the device configuration and register settings. Use a logic analyzer or oscilloscope to debug the communication protocol, and consult the datasheet and application notes for troubleshooting guidelines.
The DS1830AU+T&R is a surface-mount device and may not be suitable for high-vibration or high-shock environments. Consider using a socket or a more ruggedized package option, and ensure that the PCB is properly secured and mechanically designed to withstand the environmental stresses.