The recommended PCB layout for the DS21354L+ involves placing the device near the edge of the board, with the transmitter and receiver channels separated by a ground plane to minimize crosstalk. A 50Ω impedance-controlled transmission line should be used for the transmitter and receiver lines.
To ensure reliable operation of the DS21354L+ in high-temperature environments, it is recommended to follow proper thermal design guidelines, including providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device.
When using the DS21354L+ in a system with multiple transceivers, it is essential to consider the effects of crosstalk, electromagnetic interference (EMI), and signal reflections. Proper PCB layout, shielding, and signal termination techniques should be employed to minimize these effects.
To troubleshoot issues with the DS21354L+, start by verifying the power supply voltage, clock frequency, and signal integrity. Use oscilloscopes and logic analyzers to monitor the transmitter and receiver signals, and check for proper termination and impedance matching.
When using the DS21354L+ in a system with long cable lengths, it is essential to consider the effects of signal attenuation, dispersion, and reflections. Proper cable selection, signal amplification, and equalization techniques should be employed to ensure reliable data transmission.
DS21354L+ datasheet
by Maxim Integrated Products
