The recommended PCB layout for the DS21354LN+ involves placing the device near the edge of the board, using a solid ground plane, and minimizing the length of the transmission lines. A 4-layer board with a dedicated ground plane is recommended.
To ensure reliable operation in high-temperature environments, ensure that the device is properly heat-sinked, and the PCB is designed to minimize thermal resistance. Additionally, consider using thermal vias and thermal pads to improve heat dissipation.
When using the DS21354LN+ in a system with multiple transceivers, ensure that each transceiver has its own dedicated transformer and that the transformers are properly isolated from each other to prevent crosstalk and interference.
To troubleshoot issues with the DS21354LN+, start by verifying the power supply voltage, checking for proper termination, and ensuring that the device is properly configured. Use an oscilloscope to monitor the signal quality and check for any signs of signal degradation or distortion.
To minimize EMI and RFI, ensure that the DS21354LN+ is properly shielded, and the PCB is designed with EMI and RFI in mind. Use a metal enclosure, and consider using EMI filters and shielding materials to reduce emissions.
DS21354LN+ datasheet
by Maxim Integrated Products
