A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a decoupling capacitor (e.g., 0.1uF) between VCC and GND, and place it close to the device.
Ensure good airflow around the device, and avoid blocking the airflow with components or obstacles. Use a heat sink if the device is expected to operate in high-temperature environments. Monitor the device's temperature using the internal temperature sensor or an external thermometer.
Power up the device in the following sequence: VCC, then AVCC, and finally, the digital inputs. This ensures that the analog and digital circuits are powered up correctly and reduces the risk of latch-up or damage.
Store the device in its original packaging or an equivalent ESD-protective package. Avoid bending or flexing the leads, and handle the device by the body, not the leads. Use anti-static wrist straps or mats when handling the device.
Use 50-ohm termination resistors for the differential pairs (e.g., RDIFF) and 1-kohm resistors for the single-ended signals (e.g., RTERM). These values can be adjusted based on the specific application and signal integrity requirements.
DS2250-32-16+ datasheet
by Maxim Integrated Products
