DS25BR120TSD/NOPB datasheet by Texas Instruments

DS25BR120TSD/NOPB Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
• How do I ensure reliable operation at high temperatures?
  Ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.
• What is the maximum allowable voltage on the input pins?
  The maximum allowable voltage on the input pins is 5.5V, which is the absolute maximum rating. Operating the device above this voltage can cause permanent damage.
• Can I use this device in a high-reliability or aerospace application?
  Yes, the DS25BR120TSD/NOPB is a radiation-hardened device, making it suitable for high-reliability and aerospace applications. However, additional testing and qualification may be required for specific applications.
• How do I handle ESD protection during handling and assembly?
  Follow standard ESD handling procedures, such as using ESD-safe workstations, wrist straps, and packaging materials. The device also has built-in ESD protection, but it's not a substitute for proper handling procedures.