Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as separating analog and digital grounds, using a solid ground plane, and minimizing trace lengths. Additionally, consider using a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
To ensure the DS26LS32CMX operates within the specified temperature range (-40°C to 125°C), it's crucial to provide adequate heat sinking, especially in high-power applications. Use a thermal pad or a heat sink with a thermal conductivity of at least 1 W/m-K, and ensure good airflow around the device.
The maximum allowed voltage on the input pins is 5.5V. To protect against overvoltage, use voltage-limiting resistors or a voltage clamp circuit to prevent voltage exceeding the maximum rating. Additionally, consider using a TVS (Transient Voltage Suppressor) diode to protect against voltage spikes and transients.
To ensure proper operation, follow the recommended power-up and power-down sequencing in the datasheet. Power up the device in the following order: VCC, VREF, and then the input signals. When powering down, reverse the sequence. Additionally, consider using a power sequencing controller or a voltage supervisor to ensure proper power-up and power-down sequencing.
The recommended input impedance for the DS26LS32CMX is 1 kΩ or higher. A lower input impedance can lead to signal attenuation, distortion, and increased power consumption. Ensure that the input impedance is within the recommended range to maintain signal integrity and optimal device performance.
DS26LS32CMX datasheet
by Texas Instruments
