Maxim Integrated provides a recommended PCB layout in the DS2775G+T&R evaluation kit documentation, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize thermal resistance.
The total error budget for the DS2775G+T&R can be calculated by considering all sources of error, including the device's specified accuracy, temperature coefficient, and noise, as well as external factors such as PCB layout, component tolerances, and environmental conditions. A detailed error budget calculation can be found in the DS2775G+T&R application note.
The recommended calibration procedure for the DS2775G+T&R involves a two-point calibration, where the device is calibrated at two known temperatures (typically 0°C and 50°C) to determine the gain and offset coefficients. The calibration procedure is described in detail in the DS2775G+T&R datasheet and application note.
To ensure proper thermal coupling, the DS2775G+T&R should be mounted in close proximity to the battery or system being monitored, with a thermal interface material (such as thermal tape or thermal grease) applied between the device and the battery or system. The device's thermal pad should be connected to a copper plane on the PCB to facilitate heat transfer.
The maximum allowed voltage on the VCC pin of the DS2775G+T&R is 5.5V. Operating the device above this voltage can cause permanent damage or affect its performance, including increased power consumption and reduced accuracy. It is recommended to operate the device within the specified voltage range of 2.7V to 5.5V to ensure optimal performance.
DS2775G+T&R datasheet
by Maxim Integrated Products
