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    Part Img DS34T108GN datasheet by Maxim Integrated Products

    • Single/Dual/Quad/Octal TDM-Over-Packet Chip
    • Original
    • No
    • No
    • Obsolete
    • EAR99
    • 8542.39.00.01
    • 8542.39.00.00
    • Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

    DS34T108GN datasheet preview

    DS34T108GN Price & Stock

    Distributor Stock Lead Time Min Order Qty Price Buy
    DigiKey () 60 1
    • 1 $225.24
    • 10 $192.71
    • 100 $192.71
    • 1000 $192.71
    • 10000 $192.71
    Buy Now
    500
    • 1 -
    • 10 -
    • 100 -
    • 1000 $90.01
    • 10000 $90.01
    Buy Now
    Win Source Electronics 1,872
    • 1 $101.77
    • 10 $82.69
    • 100 $82.69
    • 1000 $82.69
    • 10000 $82.69
    Buy Now

    DS34T108GN Frequently Asked Questions (FAQs)

    • Maxim provides a recommended PCB layout in the datasheet, which includes a 4-layer board with a solid ground plane, and specific guidelines for component placement and routing. It's essential to follow these guidelines to ensure optimal performance and minimize noise.
    • The DS34T108GN has a thermal pad that must be connected to a solid ground plane or a thermal relief pattern to dissipate heat. Ensure good thermal conductivity by using a thermal interface material (TIM) and a heat sink if necessary. Follow Maxim's thermal management guidelines for optimal performance.
    • The maximum cable length supported by the DS34T108GN depends on the specific application and the type of cable used. As a general guideline, Maxim recommends keeping the cable length as short as possible (less than 1 meter) to minimize signal degradation and ensure reliable operation.
    • While the DS34T108GN is primarily designed for PCIe applications, it can be used in other high-speed differential signaling applications with proper design and layout considerations. However, it's essential to consult with Maxim's support team to ensure the device meets the specific requirements of your application.
    • To troubleshoot signal integrity issues, use a combination of simulation tools, such as IBIS-AMI models, and measurement tools, like oscilloscopes and signal analyzers. Analyze the signal waveform, eye diagram, and jitter to identify the root cause of the issue. Consult Maxim's application notes and support resources for guidance on signal integrity analysis and troubleshooting.
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