A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
Ensure good thermal management by providing adequate heat sinking and airflow. Use thermal interface materials and follow the recommended thermal design guidelines.
Use level shifters or voltage translators to ensure signal integrity and prevent voltage damage. Ensure that the power supplies are properly sequenced and monitored.
Use oscilloscopes and logic analyzers to capture waveforms and debug signals. Check the power supply voltage, current, and noise levels. Consult the datasheet and application notes for troubleshooting guidelines.
Follow proper PCB layout and shielding techniques to minimize EMI and RFI. Use EMI filters, chokes, and shielding to reduce emissions and susceptibility.