A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a common mode filter or a ferrite bead to reduce EMI.
Ensure proper thermal management by providing adequate heat sinking and airflow. Use a thermal interface material to improve heat transfer between the device and the heat sink. Follow the recommended operating conditions and derating guidelines.
Use a low-ESR capacitor (e.g., 0.1 μF) close to the device's power pins. Add a bulk capacitor (e.g., 10 μF) farther away from the device. Ensure the power supply can provide the required current and has a low ripple voltage.
Use a high-quality clock source with low jitter. Ensure the clock frequency is within the recommended range. Use the device's built-in clock synchronization features, such as the clock data recovery (CDR) circuit.
Use a controlled impedance PCB design. Terminate the transmission lines with a series resistor and a shunt capacitor. Use a common mode filter or a ferrite bead to reduce EMI. Ensure the signal amplitude and frequency are within the recommended range.