Texas Instruments provides a recommended PCB layout guide in the DS90UR906QSQX/NOPB datasheet, which includes guidelines for signal routing, power supply decoupling, and thermal management. Additionally, TI recommends using a 4-layer PCB with a solid ground plane and a separate power plane to minimize noise and ensure signal integrity.
To ensure reliable operation over the entire operating temperature range (-40°C to 105°C), it is essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device. Additionally, TI recommends using a thermal pad on the bottom of the package to improve heat dissipation.
Texas Instruments recommends using a combination of ceramic and electrolytic capacitors for power supply decoupling. A 10uF ceramic capacitor and a 22uF electrolytic capacitor in parallel are recommended for the 1.8V supply, and a 10uF ceramic capacitor and a 47uF electrolytic capacitor in parallel are recommended for the 3.3V supply.
To troubleshoot issues with clocking and synchronization, TI recommends using an oscilloscope to verify the clock signals and ensure they meet the specified jitter and frequency requirements. Additionally, checking the device's register settings and ensuring that the clocking and synchronization modes are correctly configured can help identify and resolve issues.
While the DS90UR906QSQX/NOPB has built-in diagnostic features such as internal loopback and PRBS (Pseudo-Random Binary Sequence) generation, these features are limited to specific test modes and may not be available in all operating modes. Additionally, the device's diagnostic features may not detect all possible faults or errors, and external test equipment may be required for more comprehensive testing.
DS90UR906QSQX/NOPB datasheet
by Texas Instruments
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