A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital signal traces separate and avoid crossing them over each other.
Use a high-quality, low-ESR capacitor (e.g., 10uF) for power decoupling, and place it as close to the device as possible. Ensure the power supply is clean and regulated, with minimal noise and ripple.
Use a single, low-jitter clock source (e.g., a crystal oscillator) and distribute it to the device using a clock buffer or repeater. Avoid using multiple clock sources or clock multiplication.
Use a heat sink or thermal pad to dissipate heat, especially in high-power or high-temperature applications. Ensure good airflow and avoid blocking airflow around the device.
Use shielding, filtering, and grounding techniques to minimize EMI and RFI. Keep sensitive analog signals away from digital signals and use twisted pairs or shielded cables for signal transmission.
DS92001TMA/NOPB datasheet
by Texas Instruments
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