Texas Instruments provides a recommended PCB layout in the application note SLVA466, which includes guidelines for signal routing, power supply decoupling, and thermal management to ensure optimal performance and minimize signal integrity issues.
To ensure reliable operation over the full industrial temperature range (-40°C to 85°C), it is essential to follow proper PCB design and layout guidelines, use a suitable thermal interface material, and ensure that the device is properly powered and decoupled. Additionally, consider using a thermal analysis tool to simulate the device's thermal performance and identify potential hotspots.
Operating the DS92LV090ATVEHX/NOPB at a lower voltage than the recommended 3.3V may result in reduced performance, increased power consumption, and potential reliability issues. Operating at a higher voltage may result in increased power consumption, heat generation, and potential damage to the device. It is recommended to operate the device within the specified voltage range to ensure optimal performance and reliability.
To troubleshoot signal integrity issues on the LVDS lanes, use a high-speed oscilloscope to capture the signal waveforms and analyze them for amplitude, jitter, and skew. Check the PCB layout for signal routing and termination issues, and ensure that the device is properly powered and decoupled. Additionally, consider using a signal integrity analysis tool to simulate the signal behavior and identify potential issues.
The DS92LV090ATVEHX/NOPB is a high-speed device that can generate electromagnetic interference (EMI) and radio-frequency interference (RFI). To minimize EMI and RFI, follow proper PCB design and layout guidelines, use shielding and grounding techniques, and ensure that the device is properly powered and decoupled. Additionally, consider using EMI and RFI shielding materials and components to reduce radiation and susceptibility.
DS92LV090ATVEHX/NOPB datasheet
by Texas Instruments
