Texas Instruments recommends a 4-layer PCB with a solid ground plane, and to keep the analog and digital sections separate. Additionally, it's recommended to use a decoupling capacitor (e.g., 0.1uF) between VCC and GND, and to keep the signal traces as short as possible.
To ensure the DS96F175MJ-QMLV operates within its specified temperature range, it's recommended to provide adequate heat sinking, use a thermal interface material (e.g., thermal tape or thermal grease), and ensure good airflow around the device. Additionally, consider using a thermistor or thermocouple to monitor the device temperature.
Texas Instruments recommends a power-up sequence of VCC first, followed by VDD, and then the input signals. For power-down, the sequence should be reversed. Additionally, it's recommended to use a power-on reset (POR) circuit to ensure the device resets properly during power-up.
During power-up and power-down, it's recommended to keep the analog and digital pins in a high-impedance state (e.g., using a pull-up or pull-down resistor) to prevent unwanted voltage levels. Additionally, consider using a voltage clamp or a Schottky diode to protect the pins from overvoltage conditions.
To protect the DS96F175MJ-QMLV from electrostatic discharge (ESD), it's recommended to use ESD protection devices (e.g., TVS diodes or ESD arrays) on the input and output pins. Additionally, consider using an ESD-protected socket or connector, and follow proper handling and storage procedures to prevent ESD damage.
DS96F175MJ-QMLV datasheet
by Texas Instruments
