Texas Instruments provides a recommended layout and routing guide in the DSD1793DB datasheet, but it's also important to follow general high-speed PCB design principles, such as using a solid ground plane, minimizing trace lengths, and avoiding vias and right-angle turns.
Optimizing performance requires understanding the specific requirements of your application, such as signal frequency, amplitude, and impedance. TI provides application notes and design guides that can help, but it's also recommended to consult with TI's technical support team or a experienced analog design engineer.
The DSD1793DB has a maximum junction temperature of 150°C, and thermal considerations are critical to ensure reliable operation. Ensure good thermal conductivity between the device and the PCB, use thermal vias, and consider heat sinks or thermal interface materials if necessary.
To minimize EMI and RFI, use proper shielding, grounding, and filtering techniques. Ensure that the PCB layout is designed to minimize radiation, and consider using EMI filters or shielding cans around the device.
The DSD1793DB has specific power sequencing requirements to ensure proper operation. The recommended power-up sequence is VDD, then VREF, and finally the analog input signal. Consult the datasheet for specific details.
DSD1793DB datasheet
by Texas Instruments
