A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are recommended for optimal thermal performance.
Ensure that the device is operated within the recommended operating temperature range (–40°C to +125°C). Use a heat sink or thermal interface material to improve heat dissipation, and avoid exceeding the maximum junction temperature (150°C).
A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for input decoupling, placed as close to the device as possible.
Use a voltage regulator or a transient voltage suppressor (TVS) to protect the device from overvoltage conditions. For undervoltage protection, use a voltage supervisor or a reset IC to monitor the input voltage and reset the device if it falls below a certain threshold.
A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for output filtering, placed as close to the device as possible.